Preparation of polymer, resulting polymer, resist composition, and patterning process

ABSTRACT

A sulfonic acid anion-containing polymer having a triarylsulfonium cation is prepared by (1) preparing a sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto, (2) purifying the polymer by water washing or crystallization, and (3) then reacting the polymer with a triarylsulfonium salt. A resist composition comprising the inventive polymer is effective for controlling acid diffusion since the sulfonium salt is bound to the polymer backbone.

CROSS-REFERENCE TO RELATED APPLICATION

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 2012-039638 filed in Japan on Feb. 27, 2012, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

This invention relates to (1) a novel method of preparing a polymer having a triarylsulfonium salt, (2) a polymer obtained from the method and capable of generating sulfonic acid in response to high-energy radiation or heat, (3) a resist composition comprising the polymer, and (4) a pattern forming process using the resist composition.

BACKGROUND ART

To meet the demand for higher integration density and operating speed of LSIs, the effort to reduce the pattern rule is in rapid progress. The wide-spreading flash memory market and the demand for increased storage capacities drive forward the miniaturization technology. As the advanced miniaturization technology, manufacturing of microelectronic devices at the 65-nm node by the ArF lithography has been implemented in a mass scale. Manufacturing of 45-nm node devices by the next generation ArF immersion lithography is approaching to the verge of high-volume application. The candidates for the next generation 32-nm node include ultra-high NA lens immersion lithography using a liquid having a higher refractive index than water in combination with a high refractive index lens and a high refractive index resist film, extreme ultraviolet (EUV) lithography of 13.5 nm wavelength, and double patterning version of the ArF lithography, on which active research efforts have been made. Also, resist materials sensitive to high-energy radiation of short wavelength, typically electron beam (EB) find use in the mask image writing application.

The ArF lithography started partial use from the fabrication of 130-nm node devices and became the main lithography since 90-nm node devices. Although lithography using F₂ laser (157 nm) was initially thought promising as the next lithography for 45-nm node devices, its development was retarded by several problems. A highlight was suddenly placed on the ArF immersion lithography that introduces a liquid having a higher refractive index than air (e.g., water, ethylene glycol, glycerol) between the projection lens and the wafer, allowing the projection lens to be designed to a numerical aperture (NA) of 1.0 or higher and achieving a higher resolution. See Non-Patent Document 1.

In the photolithography using an ArF excimer laser (wavelength 193 nm), a high sensitivity resist material capable of achieving a high resolution at a small dose of exposure is needed to prevent the degradation of precise and expensive optical system materials. Among several measures for providing high sensitivity resist material, the most common is to select each component which is highly transparent at the wavelength of 193 nm. For example, polymers of acrylic acid and derivatives thereof, norbornene-maleic anhydride alternating copolymers, polynorbornene, ring-opening metathesis polymerization (ROMP) polymers, and hydrogenated ROMP polymers have been proposed as the base resin. This choice is effective to some extent in that the transparency of a resin alone is increased.

Studies have also been made on photoacid generators. PAGs capable of generating perfluoroalkanesulfonic acids having a high acid strength are generally used in ArF chemically amplified resist compositions. These PAGs capable of generating perfluoroalkanesulfonic acids were already developed for use in the KrF resist compositions. For instance, Patent Documents 1 and 2 describe PAGs capable of generating perfluorohexanesulfonic acid, perfluorooctanesulfonic acid, perfluoro-4-ethylcyclohexanesulfonic acid, and perfluorobutanesulfonic acid.

Among these, perfluorooctanesulfonic acid and homologues thereof (collectively referred to as PFOS) are considered problematic with respect to their non-degradability and biological concentration in the environment. Manufacturers made efforts to develop partially fluorinated alkane sulfonic acids having a reduced degree of fluorine substitution as the replacement to PFOS. For instance, Patent Document 3 refers to the synthesis of difluoroalkanesulfonic acid salts from difluoroalkene and a sulfur compound and discloses a resist composition comprising a PAG which generates such sulfonic acid upon exposure, specifically di(4-tert-butyl-phenyl)iodonium 1,1-difluoro-2-(1-naphthyl)ethanesulfonate. Patent Document 4 refers to the development of tetrafluoroalkanesulfonic acid salts from tetrafluoro-iodoalkane and sulfur compound and discloses a resist composition comprising a PAG capable of generating such a sulfonic acid.

However, as the circuit line width is reduced by the recent rapid advance of technology, the degradation of contrast by acid diffusion becomes more serious for the resist material even when partially fluorinated alkanesulfonic acid generators as mentioned above are used. The reason is that the pattern feature size is approaching the diffusion length of acid, and this causes degradations of mask fidelity, line width roughness (LWR) and pattern rectangularity. Accordingly, to gain more benefits from a reduction of exposure light wavelength and an increase of lens NA, the resist material is required to increase a dissolution contrast or restrain acid diffusion, as compared with the prior art materials.

Under the circumstances, it was proposed to incorporate a PAG into a polymer for suppressing acid diffusion. For instance, Patent Document 5 describes a polymer using an acryloyloxyphenyldiphenylsulfonium salt as a monomer. Patent Document 6 proposes to incorporate the monomer into a polyhydroxystyrene resin for improving the LWR of this base resin. However, since the sulfonium salt is bound at its cation side to the polymer, the sulfonic acid generated therefrom upon exposure to high-energy radiation is equivalent to the sulfonic acids generated by conventional PAGs. These proposals are thus insufficient to suppress acid diffusion and unsatisfactory to overcome the outstanding problem. Also, Patent Document 7 discloses sulfonium salts having an anion side incorporated into the polymer backbone such as polystyrenesulfonic acid. The acids generated therefrom are arenesulfonic and alkylsulfonic acid derivatives which have too low an acid strength to sever acid labile groups, especially acid labile groups in ArF chemically amplified resist compositions. Patent Document 8 discloses polymers having three partially fluorinated sulfonic acid anions in combination with a specific lactone compound. Patent Document 9 describes exemplary three anions. Since they are esters of carboxylic acids which are strong acids, they are expected to be readily hydrolyzable and low stable. Copolymers derived therefrom have an insufficient solubility in resist solvents. Furthermore, Patent Document 10 discloses a sulfonium salt having a partially fluorinated alkane sulfonic acid anion as a polymerizable unit, which has insufficient resist performance in terms of resolution and LWR. In the lithography of the advanced generation toward further miniaturization as typified by the ArF immersion lithography, the task of reducing defects has not been fully met.

Extreme ultraviolet (EUV) lithography is regarded promising as the exposure technology following the ArF lithography while electron beam (EB) lithography is adopted for mask image writing. For these lithography processes, it would be desirable to have a resist composition exhibiting improved resist profile, pattern roughness (LWR) and minimized defects while suppressing the impact of acid diffusion so that the resist may comply with the current requirement of further pattern miniaturization.

CITATION LIST

-   Patent Document 1: JP 4421707 (U.S. Pat. No. 7,704,668) -   Patent Document 2: JP-A H11-282168 (U.S. Pat. No. 6,048,672) -   Patent Document 3: JP 4211971 (WO 02/42845) -   Patent Document 4: JP 4110319 (U.S. Pat. No. 6,908,722, EP 1270553) -   Patent Document 5: JP-A H04-230645 -   Patent Document 6: JP 4244755 -   Patent Document 7: JP 3613491 (U.S. Pat. No. 5,945,250) -   Patent Document 8: WO 06/121096 -   Patent Document 9: JP-A 2007-197718 -   Patent Document 10: JP-A 2008-133448 -   Non-Patent Document 1: Journal of Photopolymer Science and     Technology, Vol. 17, No. 4, p587 (2004)

DISCLOSURE OF INVENTION

An object of the invention is to provide a method of preparing a triarylsulfonium salt-containing polymer having an anion moiety bound to the polymer backbone; a polymer obtained from the method; a resist composition comprising the polymer as base resin, which exhibits high resolution, improved LWR and minimal defects when processed by photolithography using high-energy radiation such as ArF excimer laser, EUV or EB; and a pattern forming process using the resist composition.

The inventors have found that a specific method is effective for preparing a triarylsulfonium salt-containing polymer having an anion moiety bound to the polymer backbone, and that a resist composition comprising the resulting polymer as a base resin exhibits improved resist properties including pattern profile and roughness (LWR), and leaves minimal defects. The resist composition is very effective for precise micropatterning.

The invention provides (1) a method of preparing a triarylsulfonium salt-containing polymer, (2) a polymer obtained from the method and capable of generating sulfonic acid in response to high-energy radiation or heat, (3) a resist composition comprising the polymer, and (4) a pattern forming process using the resist composition.

In one aspect, the invention provides a method of preparing a sulfonic acid anion-containing polymer having a triarylsulfonium cation, comprising the steps of:

(1) preparing a sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto,

(2) subjecting the polymer to water washing or crystallization, and

(3) then reacting the polymer with a triarylsulfonium salt.

In one preferred embodiment, the anion moiety of sulfonic acid anion-containing unit in the sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto is of the structure having the general formula (1):

wherein R¹ is hydrogen, fluorine, methyl or trifluoromethyl, and L is a divalent C₁-C₂₀ organic group which may contain a heteroatom.

Also preferably, in step (3), a triarylsulfonium salt having the general formula (7) acts on a polymer having the general formula (5) to induce cation exchange reaction.

Herein R¹ is hydrogen, fluorine, methyl or trifluoromethyl, L is a divalent C₁-C₂₀ organic group which may contain a heteroatom, and M⁺ is an ammonium or metal cation.

S⁺(Ar)₃X⁻  (7)

Herein Ar is a substituted or unsubstituted C₆-C₂₀ aryl group which may contain a heteroatom, a plurality of Ar groups may bond together directly or via an oxygen atom, methylene, sulfonyl or carbonyl moiety, and X⁻ is an anion.

In a preferred embodiment, the sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto further comprises recurring units having the general formula (2):

wherein R^(1′) is hydrogen, fluorine, methyl or trifluoromethyl, Z is a single bond, phenylene, naphthylene or (backbone) —C(═O)—O—Z′—, Z′ is a straight, branched or cyclic C₁-C₁₀ alkylene group which may contain a hydroxyl radical, ether bond, ester bond, or lactone ring, or a phenylene or naphthylene group, and XA is an acid labile group.

In a more preferred embodiment, the sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto further comprises recurring units having the general formula (3):

wherein R^(1″) is hydrogen, fluorine, methyl or trifluoromethyl, and YL is a polar group having one or more structures selected from the group consisting of hydroxyl, cyano, carbonyl, ether bond, ester bond, sulfonic acid ester bond, carbonate, lactone ring, sultone ring, and carboxylic anhydride.

Preferably, the step (3) of reacting the polymer from step (2) with a triarylsulfonium salt is performed in a two-layer system using water and an organic solvent separable from water.

In another aspect, the invention provides a polymer prepared by the method defined above.

In a further aspect, the invention provides a resist composition comprising a polymer prepared by the method defined above. The resist composition may further comprise one or more of a photoacid generator, quencher, solvent, and surfactant.

In a still further aspect, the invention provides a pattern forming process comprising the steps of coating the resist composition defined above onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, and developing it in a developer.

In a preferred embodiment, the high-energy radiation has a wavelength in the range of 180 to 250 nm.

In another preferred embodiment, the step of exposing to high-energy radiation includes immersion lithography of exposing the resist film to radiation via a liquid. The pattern forming process may further comprise the step of forming a protective film on the resist film, so that the protective film intervenes between the resist film and the liquid during the immersion lithography.

In another preferred embodiment, the high-energy radiation is EUV or EB.

The resist composition is not only effective in the ArF dry lithography and ArF immersion lithography, but is also applicable to other lithography processes using high-energy radiation such as KrF excimer laser, EUV, and EB.

Advantageous Effects of Invention

Since the method employs very mild conditions for polymer synthesis, a sulfonic acid anion-containing polymer having a triarylsulfonium cation can be readily prepared. The resist composition comprising the polymer obtained from the inventive method is effective for controlling acid diffusion since the sulfonium salt is incorporated in and bound to the polymer backbone. When the resist composition is processed by the lithography, pattern profile and LWR are improved, and the number of defects is minimized. The resist composition is very effective for precise micropatterning.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram of ¹H-NMR spectroscopy of Polymer P-1 in Synthesis Example 2-1.

FIG. 2 is a diagram of ¹H-NMR spectroscopy of Polymer P-11 in Synthesis Example 2-11.

DESCRIPTION OF EMBODIMENTS

The singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise. “Optional” or “optionally” means that the subsequently described event or circumstances may or may not occur, and that description includes instances where the event or circumstance occurs and instances where it does not. The notation (Cn-Cm) means a group containing from n to m carbon atoms per group.

The abbreviations have the following meaning.

EB: electron beam UV: ultraviolet EUV: extreme ultraviolet PAG: photoacid generator PEB: post-exposure bake LWR: line width roughness

The term “high-energy radiation” is intended to encompass UV, deep UV, EUV, EB, x-ray, excimer laser, gamma-ray and synchrotron radiation.

One embodiment of the invention is a method of preparing a triarylsulfonium salt-containing polymer having an anion moiety bound thereto. The term “triarylsulfonium salt” refers to a salt having the general formula (4).

S⁺(Ar)₃  (4)

Herein Ar is a substituted or unsubstituted C₆-C₂₀ aryl group which may contain a heteroatom, a plurality of Ar groups may bond together directly or via an oxygen atom, methylene, sulfonyl or carbonyl moiety.

In formula (4), Ar is a substituted or unsubstituted C₆-C₂₀ aryl group which may contain a heteroatom, or a plurality of Ar groups may bond directly or via an oxygen atom, methylene, sulfone or carbonyl moiety. Typical of the heteroatom contained are oxygen, nitrogen, sulfur and halogen atoms, with the oxygen and fluorine atoms being preferred. Suitable substituent radicals include straight, branched or cyclic C₁-C₆ alkyl radicals, straight, branched or cyclic C₁-C₆ alkoxy radicals, alkoxyalkyl radicals, alkoxyalkoxy radicals, hydroxyl radicals, fluoro, chloro, N,N-dialkylamino radicals in which the alkyl moiety has 1 to 4 carbon atoms, mono- or polycyclic lactone radicals of 4 to 10 carbon atoms, straight, branched or cyclic C₁-C₁₄ alkyloxycarbonylmethoxy radicals, methylthio radicals, phenylthio radicals, and C₁-C₁₁ acyloxy radicals. Although the number of substituent radicals is arbitrary, mono or di-substitution is preferred, if any, with mono-substitution being most preferred. Exemplary substituent radicals include methyl, ethyl, propyl, 1-methylethyl, butyl, 1,1-dimethylethyl, hexyl, cyclohexyl, methoxy, ethoxy, propoxy, butoxy, 1,1-dimethylethoxy, hexyloxy, cyclohexyloxy, 2-methoxyethoxy, 2-(2-methoxyethoxy)ethoxy, 2,2,2-trifluoroethoxy, N,N-dimethylamino, 1,1-dimethylethoxycarbonylmethoxy, 1-methyladamantan-1-yloxycarbonylmethoxy, acetyl, pivaloyloxy, and adamantan-1-ylcarbonyloxy.

Suitable groups of Ar include, but are not limited to, phenyl, naphthyl (with any substitution position to the sulfur atom of sulfonium cation), anthryl, phenanthryl, pyrenyl, tolyl, xylyl, trimethylphenyl (with any substitution position to the sulfur atom of sulfonium cation), ethylphenyl, biphenylyl, methoxyphenyl, fluorophenyl, difluorophenyl, tert-butylphenyl, ethoxyphenyl, butoxyphenyl, tert-butoxyphenyl, methylthiophenyl, trifluoromethylphenyl, acetoxyphenyl, hydroxyphenyl, N,N-dimethylaminophenyl, methylnaphthyl, hydroxynaphthyl, dihydroxynaphthyl, methoxynaphthyl, butoxynaphthyl, 2,2,2-trifluoroethoxynaphthyl, and (2-methoxyethoxy)naphthyl.

When a plurality of Ar groups bond directly or via an oxygen atom, methylene, sulfone or carbonyl moiety, dibenzothiophene skeleton, phenoxathiin skeleton, and other partial structures as shown below are exemplary.

Herein the broken line denotes a bond to another Ar group.

Examples of the sulfonium cation include, but are not limited to, triphenylsulfonium, 4-hydroxyphenyldiphenylsulfonium, bis(4-hydroxyphenyl)phenylsulfonium, tris(4-hydroxyphenyl)sulfonium, 4-tert-butoxyphenyldiphenylsulfonium, bis(4-tert-butoxyphenyl)phenylsulfonium, tris(4-tert-butoxyphenyl)sulfonium, 3-tert-butoxyphenyldiphenylsulfonium, bis(3-tert-butoxyphenyl)phenylsulfonium, tris(3-tert-butoxyphenyl)sulfonium, 4-tert-butylphenyldiphenylsulfonium, tris(4-tert-butylphenyl)sulfonium, 3,4-di-tert-butoxyphenyldiphenylsulfonium, bis(3,4-di-tert-butoxyphenyl)phenylsulfonium, tris(3,4-di-tert-butoxyphenyl)sulfonium, diphenyl(4-thiophenoxyphenyl)sulfonium, 10-phenylphenoxathiinium, S-phenyldibenzothiophenium, 4-tert-butoxycarbonylmethyloxyphenyldiphenylsulfonium, tris(4-tert-butoxycarbonylmethyloxyphenyl)sulfonium, (4-tert-butoxyphenyl)bis(4-dimethylaminophenyl)sulfonium, tris(4-dimethylaminophenyl)sulfonium, 2-naphthyldiphenylsulfonium, (4-hydroxy-3,5-dimethylphenyl)diphenylsulfonium, and (4-n-hexyloxy-3,5-dimethylphenyl)diphenylsulfonium. Of these, triphenylsulfonium, 4-tert-butylphenyldiphenylsulfonium, 4-tert-butoxyphenyldiphenylsulfonium, 10-phenylphenoxathiinium, and S-phenyldibenzothiophenium are more preferred. Inter alia, triphenylsulfonium, 4-tert-butylphenyldiphenylsulfonium, and 4-tert-butoxyphenyldiphenylsulfonium are most preferred.

With respect to the synthesis of the sulfonium cation, reference may be made to JP-A 2007-145797, JP-A 2009-007327, and JP-A 2009-091350, for example.

The polymer is characterized by a triarylsulfonium salt whose anion moiety is bound to the polymer backbone. The preferred anion moiety has the structure of difluorosulfonate having the general formula (1).

Herein R¹ is hydrogen, fluorine, methyl or trifluoromethyl, and L is a divalent C₁-C₂₀ organic group which may contain a heteroatom.

Examples of the divalent organic group represented by L include straight alkanediyl groups such as methylene, ethylene, propane-1,3-diyl, butane-1,4-diyl, pentane-1,5-diyl, hexane-1,6-diyl, heptane-1,7-diyl, octane-1,8-diyl, nonane-1,9-diyl, decane-1,10-diyl, undecane-1,11-diyl, dodecane-1,12-diyl, tridecane-1,13-diyl, tetradecane-1,14-diyl, pentadecane-1,15-diyl, hexadecane-1,16-diyl, and heptadecane-1,17-diyl; branched alkanediyl groups obtained by adding a side chain such as methyl, ethyl, propyl, isopropyl, butyl, sec-butyl or tert-butyl to the foregoing straight alkanediyl groups; divalent saturated cyclic hydrocarbon groups such as cyclopentanediyl, cyclohexanediyl, norbornanediyl, and adamantanediyl; and divalent unsaturated cyclic hydrocarbon groups such as phenylene and naphthylene. L may also be a combination of two or more of the foregoing groups. Also included are substituted forms of the foregoing groups in which one or more hydrogen atoms are substituted by a heteroatom or atoms such as oxygen, sulfur, nitrogen, and halogen atom to eventually form a hydroxyl, cyano, carbonyl, ether bond, ester bond, sulfonic acid ester link, carbonate, lactone ring, sultone ring, carboxylic anhydride or haloalkyl group.

Illustrative examples of the anion having formula (1) are given below. The structure of the anion moiety of the polymer is not limited thereto.

While the polymer is defined as comprising recurring units of an ionic compound consisting of an anion moiety bound to the polymer backbone and a cation moiety in the form of triarylsulfonium, it is specifically a combination of the anion structure having formula (1) with the cation structure having formula (4), for example, a combination of an exemplary anion structure with an exemplary cation structure as illustrated above.

In addition to the recurring units of an ionic compound consisting of an anion moiety bound to the polymer backbone and a cation moiety in the form of triarylsulfonium, the polymer may further comprise recurring units having an acid labile group. The recurring unit having an acid labile group typically has the general formula (2).

Herein R^(1′) is hydrogen, fluorine, methyl or trifluoromethyl. Z is a single bond, phenylene, naphthylene or (backbone) —C(═O)—O—Z′—, wherein Z′ is a straight, branched or cyclic C₁-C₁₀ alkylene group which may contain a hydroxyl radical, ether bond, ester bond or lactone ring, or Z′ is a phenylene or naphthylene group. XA is an acid labile group.

Examples of the unit having formula (2) wherein Z is a variant are shown below.

Under the action of acid, a polymer comprising recurring units of formula (2) is decomposed to generate carboxylic acid, turning to be an alkali soluble polymer. The acid labile group represented by XA may be selected from a variety of such groups. Examples of the acid labile group include groups of the following general formulae (L1) to (L4), tertiary alkyl groups of 4 to 20 carbon atoms, preferably 4 to 15 carbon atoms, trialkylsilyl groups in which each alkyl moiety has 1 to 6 carbon atoms, and oxoalkyl groups of 4 to 20 carbon atoms.

In these formulae, the broken line denotes a valence bond.

In formula (L1), R^(L01) and R^(L02) each are hydrogen or a straight, branched or cyclic alkyl group of 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms. Exemplary alkyl groups include methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, cyclopentyl, cyclohexyl, 2-ethylhexyl, n-octyl, norbornyl, tricyclodecanyl, tetracyclododecanyl, and adamantyl. R^(L03) is a monovalent hydrocarbon group of 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms, which may contain a hetero atom such as oxygen, examples of which include unsubstituted straight, branched or cyclic alkyl groups and substituted forms of such alkyl groups in which some hydrogen atoms are replaced by hydroxyl, alkoxy, oxo, amino, alkylamino or the like, or in which an oxygen atom is interposed between carbon atoms. Exemplary straight, branched or cyclic alkyl groups include methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, cyclopentyl, cyclohexyl, 2-ethylhexyl, n-octyl, norbornyl, tricyclodecanyl, tetracyclododecanyl, and adamantyl. Illustrative examples of the substituted alkyl groups are shown below.

A pair of R^(L01) and R^(L02), R^(L01) and R^(L03), or R^(L02) and R^(L03) may bond together to form a ring with the carbon and oxygen atoms to which they are attached. Each of R^(L01), R^(L02) and R^(L03) is a straight or branched alkylene group of 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms when they form a ring.

In formula (L2), R^(L04) is a tertiary alkyl group of 4 to 20 carbon atoms, preferably 4 to 15 carbon atoms, a trialkylsilyl group in which each alkyl moiety has 1 to 6 carbon atoms, an oxoalkyl group of 4 to 20 carbon atoms, or a group of formula (L1). Exemplary tertiary alkyl groups are tert-butyl, tert-amyl, 1,1-diethylpropyl, 2-cyclopentylpropan-2-yl, 2-cyclohexylpropan-2-yl, 2-(bicyclo[2.2.1]heptan-2-yl)propan-2-yl, 2-(adamantan-1-yl)propan-2-yl, 1-ethylcyclopentyl, 1-butylcyclopentyl, 1-ethylcyclohexyl, 1-butylcyclohexyl, 1-ethyl-2-cyclopentenyl, 1-ethyl-2-cyclohexenyl, 2-methyl-2-adamantyl, and 2-ethyl-2-adamantyl. Exemplary trialkylsilyl groups are trimethylsilyl, triethylsilyl, and dimethyl-tert-butylsilyl. Exemplary oxoalkyl groups are 3-oxocyclohexyl, 4-methyl-2-oxooxan-4-yl, and 5-methyl-2-oxooxolan-5-yl. Letter y is an integer of 0 to 6.

In formula (L3), R^(L05) is a substituted or unsubstituted, straight, branched or cyclic C₁-C₈ alkyl group or a substituted or unsubstituted C₆-C₂₀ aryl group. Examples of the optionally substituted alkyl group include straight, branched or cyclic alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, tert-amyl, n-pentyl, n-hexyl, cyclopentyl, and cyclohexyl, and substituted forms of such groups in which some hydrogen atoms are substituted by hydroxyl, alkoxy, carboxyl, alkoxycarbonyl, oxo, amino, alkylamino, cyano, mercapto, alkylthio, sulfo or other groups. Examples of the optionally substituted aryl groups include phenyl, methylphenyl, naphthyl, anthryl, phenanthryl, and pyrenyl. Letter m′ is equal to 0 or 1, n′ is equal to 0, 1, 2 or 3, and 2 m′+n′ is equal to 2 or 3.

In formula (L4), R^(L06) is a substituted or unsubstituted, straight, branched or cyclic C₁-C₈ alkyl group or a substituted or unsubstituted C₆-C₂₀ aryl group. Examples of these groups are the same as exemplified for R^(L05). R^(L07) to R^(L16) independently represent hydrogen or monovalent C₁-C₁₅ hydrocarbon groups. Exemplary hydrocarbon groups are straight, branched or cyclic alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, tert-amyl, n-pentyl, n-hexyl, n-octyl, n-nonyl, n-decyl, cyclopentyl, cyclohexyl, cyclopentylmethyl, cyclopentylethyl, cyclopentylbutyl, cyclohexylmethyl, cyclohexylethyl and cyclohexylbutyl, and substituted forms of these groups in which some hydrogen atoms are replaced by hydroxyl, alkoxy, carboxyl, alkoxycarbonyl, oxo, amino, alkylamino, cyano, mercapto, alkylthio, sulfo or other groups. Alternatively, R^(L07) to R^(L16), taken together, form a ring with the carbon atom to which they are attached (for example, a pair of R^(L07) and R^(L08), R^(L07) and R^(L09), R^(L07) and R^(L10), R^(L08) and R^(L10), R^(L09) and R^(L10), R^(L11) and R^(L12), or R^(L13) and R^(L14) form a ring). Each of R^(L07) to R^(L16) represents a divalent C₁-C₁₅ hydrocarbon group when they form a ring, examples of which are the ones exemplified above for the monovalent hydrocarbon groups, with one hydrogen atom being eliminated. Two of R^(L07) to R^(L16) which are attached to vicinal carbon atoms may bond together directly to form a double bond (for example, a pair of R^(L07) and R^(L09), R^(L09) and R^(Ll5), R^(L13) and R^(Ll5), or R^(L14) and R^(Ll5)).

Of the acid labile groups of formula (L1), the straight and branched ones are exemplified by the following groups.

Of the acid labile groups of formula (L1), the cyclic ones are, for example, tetrahydrofuran-2-yl, 2-methyltetrahydrofuran-2-yl, tetrahydropyran-2-yl, and 2-methyltetrahydropyran-2-yl.

Examples of the acid labile groups of formula (L2) include tert-butoxycarbonyl, tert-butoxycarbonylmethyl, tert-amyloxycarbonyl, tert-amyloxycarbonylmethyl, 1,1-diethylpropyloxycarbonyl, 1,1-diethylpropyloxycarbonylmethyl, 1-ethylcyclopentyloxycarbonyl, 1-ethylcyclopentyloxycarbonylmethyl, 1-ethyl-2-cyclopentenyloxycarbonyl, 1-ethyl-2-cyclopentenyloxycarbonylmethyl, 1-ethoxyethoxycarbonylmethyl, 2-tetrahydropyranyloxycarbonylmethyl, and 2-tetrahydrofuranyloxycarbonylmethyl groups.

Examples of the acid labile groups of formula (L3) include 1-methylcyclopentyl, 1-ethylcyclopentyl, 1-n-propylcyclopentyl, 1-isopropylcyclopentyl, 1-n-butylcyclopentyl, 1-sec-butylcyclopentyl, 1-cyclohexylcyclopentyl, 1-(4-methoxy-n-butyl)cyclopentyl, 1-methylcyclohexyl, 1-ethylcyclohexyl, 3-methyl-1-cyclopenten-3-yl, 3-ethyl-1-cyclopenten-3-yl, 3-methyl-1-cyclohexen-3-yl, and 3-ethyl-1-cyclohexen-3-yl groups.

Of the acid labile groups having formula (L4), groups having the following formulas (L4-1) to (L4-4) are preferred.

In formulas (L4-1) to (L4-4), the broken line denotes a bonding site and direction. R^(L41) is each independently a monovalent hydrocarbon group, typically a straight, branched or cyclic C₁-C₁₀ alkyl group, such as methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, tert-amyl, n-pentyl, n-hexyl, cyclopentyl and cyclohexyl.

For formulas (L4-1) to (L4-4), there can exist enantiomers and diastereomers. Each of formulae (L4-1) to (L4-4) collectively represents all such stereoisomers. Such stereoisomers may be used alone or in admixture.

For example, the general formula (L4-3) represents one or a mixture of two selected from groups having the following general formulas (L4-3-1) and (L4-3-2).

Similarly, the general formula (L4-4) represents one or a mixture of two or more selected from groups having the following general formulas (L4-4-1) to (L4-4-4).

Each of formulas (L4-1) to (L4-4), (L4-3-1) and (L4-3-2), and (L4-4-1) to (L4-4-4) collectively represents an enantiomer thereof and a mixture of enantiomers.

It is noted that in the above formulas (L4-1) to (L4-4), (L4-3-1) and (L4-3-2), and (L4-4-1) to (L4-4-4), the bond direction is on the exo side relative to the bicyclo[2.2.1]heptane ring, which ensures high reactivity for acid catalyzed elimination reaction (see JP-A 2000-336121). In preparing these monomers having a tertiary exo-alkyl group of bicyclo[2.2.1]heptane skeleton as a substituent group, there may be contained monomers substituted with an endo-alkyl group as represented by the following formulas (L4-1-endo) to (L4-4-endo). For good reactivity, an exo proportion of at least 50 mol % is preferred, with an exo proportion of at least 80 mol % being more preferred.

Illustrative examples of the acid labile group of formula (L4) are given below.

Examples of the tertiary C₄-C₂₀ alkyl groups, trialkylsilyl groups in which each alkyl moiety has 1 to 6 carbon atoms, and C₄-C₂₀ oxoalkyl groups are as exemplified for R^(L104).

Illustrative examples of the recurring units of formula (2) are given below, but not limited thereto.

While the foregoing examples correspond to those units wherein Z is a single bond, Z which is other than a single bond may be combined with similar acid labile groups. Examples of units wherein Z is other than a single bond are substantially the same as illustrated above.

Besides the acid labile group-containing units having formula (2), the polymer may further comprise additional units, typically recurring units having the general formula (3).

Herein R^(1′) is hydrogen, fluorine, methyl or trifluoromethyl. YL is a polar group having one or more structures selected from the group consisting of hydroxyl, cyano, carbonyl, ether bond, ester bond, sulfonic acid ester link, carbonate, lactone ring, sultone ring, and carboxylic anhydride.

Illustrative, non-limiting examples of the recurring units having formula (3) are shown below.

Of the recurring units having formula (3), if used, those units having a lactone ring as the polar group are most preferred.

On use, the recurring units having formula (3) are copolymerized with the anion-containing recurring units having formula (1) and the recurring units having formula (2), although they may be further copolymerized with other recurring units.

In addition to the foregoing units, the polymer may further comprise recurring units derived from carbon-to-carbon double bond-bearing monomers other than the above-described ones, for example, substituted acrylic acid esters such as methyl methacrylate, methyl crotonate, dimethyl maleate and dimethyl itaconate, unsaturated carboxylic acids such as maleic acid, fumaric acid, and itaconic acid, cyclic olefins such as norbornene, norbornene derivatives, and tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodecene derivatives, unsaturated acid anhydrides such as itaconic anhydride, and other monomers. Also, hydrogenated products of ROMP polymers as described in JP-A 2003-066612 may be used.

The polymer generally has a weight average molecular weight (Mw) of 1,000 to 500,000, and preferably 3,000 to 100,000, as measured by gel permeation chromatography (GPC) using polystyrene standards. Outside the range, there may result an extreme drop of etch resistance, and a drop of resolution due to difficulty to gain a dissolution rate difference before and after exposure.

The general method of synthesizing a resist polymer is, for example, by dissolving one or more unsaturated bond-bearing monomers in an organic solvent, adding a radical initiator, and effecting heat polymerization. Reference may be made to many documents including JP-A 2005-264103. JP-A 2010-077404 describes the synthesis of a polymer comprising copolymerized units having a triphenylsulfonium salt-containing compound whose anion is bound to the polymer backbone, which method is similar to the above-mentioned one.

However, in the process of preparing a polymer comprising recurring units having the PAG function like the above-mentioned sulfonium salt, it is often difficult to remove the residual monomer, especially the residual monomer from which sulfonium salt-containing unit is derived. In general, after a polymer for resist use is polymerized, a non-polar solvent, typically hexane, or water is often used as poor solvent for such removal, but the residual monomer corresponding to the sulfonium salt-containing unit cannot be removed, in most cases, using these species of solvent. If a highly lipophilic substituent group is introduced into the sulfonium salt, there is not only a possibility that the monomer dissolves in hexane or non-polar solvents, but also a possibility that the desired polymer also dissolves therein. For example, JP-A 2008-133448 describes synthesis examples of sulfonic acid anion-containing polymers where the polymerization reaction is followed by crystallization from hexane. Since the corresponding sulfonium salt monomer does not dissolve in hexane, the residual monomer cannot be removed in these synthesis examples.

Since the residual sulfonium salt monomer has not been incorporated in the polymer chain as a matter of course, it is presumed that acid diffusion is not suppressed, and as a result, resist performance may be degraded, for example, LWR be enlarged. Also, the residual monomer can cause defects. Accordingly, it is recommended to remove the residual monomer as much as possible from the sulfonium anion-containing polymer.

The method of the invention is designed to avoid the above-discussed problem. According to the invention, a sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto is first synthesized. Then purification such as by water washing is carried out to remove the residual monomer originating from the ionic compound. Thereafter, the polymer is subjected to cation exchange reaction with a triarylsulfonium salt to form a triarylsulfonium salt-containing polymer comprising sulfonic acid anion-containing recurring units having formula (1). The inventive method is successful in producing the desired polymer while significantly reducing the amount of the residual monomer originating from sulfonium salt as compared with the prior art method. Then a resist composition comprising the desired polymer is improved in resist properties such as pattern profile and LWR and effective for reducing the number of defects.

The precursor to the inventive polymer is a sulfonic acid anion-containing polymer having an ammonium or metal cation not bound to the polymer. Typically the sulfonic acid anion-containing polymer comprises recurring units having the general formula (5).

Herein R¹ is hydrogen, fluorine, methyl or trifluoromethyl, L is a divalent C₁-C₂₀ organic group which may contain a heteroatom, and M⁺ is an ammonium or metal cation.

In formula (5), L is a divalent organic group, examples of which are the same as previously illustrated in conjunction with formula (1). M⁺ is an ammonium or metal cation. Suitable metal cations include lithium ion, sodium ion and potassium ion. The ammonium ion is of the structure having the general formula (6).

(R²)₄N  (6)

Herein R² is each independently hydrogen, a substituted or unsubstituted, straight, branched or cyclic C₁-C₁₀ alkyl, alkenyl or oxoalkyl group or a substituted or unsubstituted C₆-C₁₈ aryl, aralkyl or aryloxoalkyl group, or at least two of R² may bond together to form a ring with the nitrogen atom in the formula.

Of the groups of R² in formula (6), suitable alkyl groups include methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclopropylmethyl, 4-methylcyclohexyl, cyclohexylmethyl, norbornyl, and adamantyl. Suitable alkenyl groups include allyl, propenyl, butenyl, hexenyl, and cyclohexenyl. Suitable oxoalkyl groups include 2-oxocyclopentyl, 2-oxocyclohexyl, 2-oxopropyl, 2-oxoethyl, 2-cyclopentyl-2-oxoethyl, 2-cyclohexyl-2-oxoethyl, and 2-(4-methylcyclohexyl)-2-oxoethyl. Suitable aryl groups include phenyl, 1-naphthyl, 2-naphthyl and thienyl, as well as hydroxyphenyl and alkoxyphenyl groups such as 4-hydroxyphenyl, p-methoxyphenyl, m-methoxyphenyl, o-methoxyphenyl, p-ethoxyphenyl, p-tert-butoxyphenyl, and m-tert-butoxyphenyl, alkylphenyl groups such as 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, ethylphenyl, 4-tert-butylphenyl, 4-butylphenyl, and 2,4-dimethylphenyl, alkylnaphthyl groups such as 1-(4-methyl)naphthyl and 2-(6-methyl)naphthyl, and alkoxynaphthyl groups such as 1-(4-methoxy)naphthyl and 2-(6-methoxy)naphthyl. Suitable aralkyl groups include benzyl, 1-phenylethyl, and 2-phenylethyl. Suitable aryloxoalkyl groups include 2-aryl-2-oxoethyl groups such as 2-phenyl-2-oxoethyl, 2-(1-naphthyl)-2-oxoethyl, and 2-(2-naphthyl)-2-oxoethyl. In these hydrocarbon groups, one or more hydrogen atoms may be substituted by a heteroatom or atoms such as oxygen, sulfur, nitrogen or halogen atom, to eventually form a hydroxyl, cyano, carbonyl, ether bond, ester bond, sulfonic acid ester link, carbonate, lactone ring, sultone ring, carboxylic anhydride, or haloalkyl group.

Alternatively, at least two of R² groups bond together to form a ring with the nitrogen atom in the formula. Exemplary ring structures include piperidine, morpholine, pyridine, quinoline, acridine, imidazole and benzimidazole in which the nitrogen atom may be protonized or alkylated.

Illustrative examples of the ammonium ion having formula (6) include ammonium, trimethylammonium, tetramethylammonium, triethylammonium, tributylammonium, tetrabutylammonium, trioctylammonium, anilinium, 2,6-dimethylanilinium, N,N-dimethylanilinium, bezyltrimethylammonium, benzyltriethylammonium, benzyltripropylammonium, N-benzyl-N,N-dimethylanilinium, and N-(p-methoxy)benzyl-N,N-dimethylanilinium. Inter alia, trimethylammonium, tetramethylammonium, triethylammonium, anilinium, and bezyltrimethylammonium are preferred.

The monomeric compound having formula (5) may be synthesized, for example, by the method of JP-A 2007-304490. First, an aliphatic or aromatic carboxylic acid ester of 1,1,3,3,3-pentafluoropropen-2-yl, typically 1,1,3,3,3-pentafluoropropen-2-yl benzoate, which was developed by Nakai et al. (see Tetrahedron Lett., vol. 29, 4119, 1988) using 1,1,1,3,3,3-hexafluoro-2-propanol as the starting reactant, is reacted with sodium hydrogen sulfite in water, forming a corresponding sulfonic acid inorganic salt such as sodium sulfonate. The acyl group of this sulfonic acid inorganic salt is subjected to hydrolysis or solvolysis, after which it is reacted with a carboxylic acid halide having a polymerizable substituent group in a conventional manner, yielding the monomeric compound having formula (5). Alternatively, the monomeric compound having formula (5) wherein M⁺ is an ammonium cation may be obtained by reacting ammonium halide, ammonium hydroxide or the like with the salt either before or after decomposition of the acyl group, and thereafter introducing a polymerizable substituent group in a similar way. Exchange reaction from metal cation to ammonium cation is a well-known procedure. For example, the reaction may be driven by mixing the corresponding metal cation-containing compound and ammonium halide in a two-layer system of organic solvent and water.

Likewise, the monomeric compound having formula (5) may also be obtained by converting the sodium salt of 2-butyl difluorosulfoacetate described in JP-A 2011-158896, the sodium salt of 1,1,2,2-tetrafluoro-4-hydroxy-butane-1-sulfonic acid described in WO 2008/56795, the sodium salt of difluorohydroxypropanesulfonic acid described in JP-A 2011-256390, or the sodium salt of difluorohydroxyethanesulfonic acid described in JP-A 2009-221454 into a metal or ammonium salt of difluorosulfonic acid having a polymerizable substituent group.

Next, the synthesis of a polymer comprising recurring units having formula (5) is described. The recurring units having formula (5) may be used as a homopolymer or copolymerized with other recurring units. Desirably, the recurring units having formula (5) are copolymerized with acid labile group-containing units having formula (2) and more desirably with units having formulae (2) and (3).

The polymer comprising recurring units having formula (5) may be synthesized by the aforementioned method, specifically by dissolving one or more unsaturated bond-containing monomers in an organic solvent, adding a radical initiator thereto, and effecting heat polymerization. Examples of the organic solvent which can be used for polymerization include aromatic solvents such as toluene and benzene, ether solvents such as tetrahydrofuran, diethyl ether and dioxane, ketone solvents such as acetone and methyl ethyl ketone, alcohols such as methanol and propylene glycol monomethyl ether, ester solvents such as ethyl acetate and propylene glycol monomethyl ether acetate (PGMEA), and halogenated solvents such as chloroform and dichloroethane. Examples of the polymerization initiator used herein include 2,2′-azobisisobutyronitrile (AIBN), 2,2′-azobis(2,4-dimethylvaleronitrile), dimethyl 2,2′-azobis(2-methylpropionate), benzoyl peroxide, and lauroyl peroxide. Preferably the system is heated at 50 to 80° C. for polymerization to take place. The reaction time is 2 to 100 hours, preferably 5 to 20 hours. When acid labile group-containing units are to be incorporated, such a unit that has been incorporated in a monomer may be kept as such, or protection or partial protection after polymerization may be adopted.

Described below is the synthesis of a sulfonic acid anion-containing polymer having a triarylsulfonium cation as used in the resist composition. The sulfonic acid anion-containing polymer having a triarylsulfonium cation is synthesized by letting a triarylsulfonium salt having the general formula (7) act on a polymer having the above formula (5) to induce cation exchange reaction.

S⁺(Ar)₃X⁻  (7)

Herein Ar is a substituted or unsubstituted C₆-C₂₀ aryl group which may contain a heteroatom, a plurality of Ar groups may bond together directly or via an oxygen atom, methylene, sulfonyl or carbonyl moiety, and X⁻ is an anion.

In formula (7), Ar is as illustrated previously, and X⁻ is an anion which may be any of conjugated bases of either inorganic acids or organic acids, for example, conjugated bases of methylsulfuric acid, methanesulfonic acid and p-toluenesulfonic acid, I⁻, Br⁻, Cl⁻, BF₄ ⁻, ClO₄ ⁻, or the like.

With respect to the synthesis of the triarylsulfonium salt having formula (7), reference may be made to JP-A 2007-145797, 2008-106045, 2009-007327, and 2009-258695.

First, a polymer comprising recurring units having formula (5) is synthesized by the aforementioned method. The polymer thus synthesized should preferably be purified by separatory operation such as water washing or crystallization. The polymer and a triarylsulfonium salt having formula (7) are mixed in a system of water and an organic solvent separable from water whereupon the organic layer is taken out. The organic layer is washed with water, if necessary. The desired polymer may be recovered from the organic layer by conventional means such as concentration or crystallization. Any organic solvent may be used herein as long as it can be separated from water and the polymer is dissolvable therein. The preferred organic solvents include ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, and halogenated solvents such as dichloromethane and chloroform.

When the compound having formula (5) wherein M⁺ is an inorganic cation such as lithium, sodium or potassium ion or an ammonium ion of 1 to 10 carbon atoms undergoes exchange reaction with a triarylsulfonium salt, there are formed the desired polymer and M⁺X⁻ which is readily extractable into the water layer. More desirably, M⁺ is trimethylammonium, tetramethylammonium, triethylammonium, anilinium, or benzyltrimethylammonium. The polymers having these species of cation are characterized by ease of polymerization and allow subsequent exchange reaction with a triarylsulfonium salt to take place rapidly.

Alternatively, the desired polymer may be obtained by dissolving a polymer comprising recurring units having formula (5) and a triarylsulfonium salt having formula (7) in an organic solvent, and pouring it into water or another organic solvent for crystallization. Preferably the good solvent is an alcohol and the poor solvent is water.

While the polymer comprises recurring units derived from monomers, the molar fractions of respective units preferably fall in the following range (mol %), but are not limited thereto.

(I) 0.2 to 20 mol %, more preferably 0.5 to 15 mol % of constituent units of sulfonic acid anion-containing compound having triarylsulfonium cation, (II) 1 to 50 mol %, more preferably 5 to 40 mol %, and even more preferably 10 to 30 mol % of constituent units of at least one type having formula (2), (III) 30 to 98.8 mol %, more preferably 45 to 94.5 mol %, and even more preferably 69.5 to 89.5 mol % of constituent units of at least one type having formula (3), and optionally, (IV) 0 to 80 mol %, more preferably 0 to 70 mol %, and even more preferably 0 to 50 mol % of constituent units of at least one type derived from another monomer(s).

The polymer is not limited to one type and a mixture of two or more polymers may be added. The use of plural polymers allows for easy adjustment of resist properties.

Resist Composition

A further embodiment of the invention is a resist composition comprising (A) the sulfonic acid anion-containing polymer having a triarylsulfonium cation defined above as essential component. The resist composition may further comprise (B) a photoacid generator capable of generating an acid upon exposure, (C) a quencher, and (D) an organic solvent. Optionally, the resist composition may further comprise (E) a surfactant which is insoluble or substantially insoluble in water and soluble in alkaline developer, and/or a surfactant which is insoluble or substantially insoluble in water and alkaline developer (hydrophobic resin), and (F) an organic acid derivative and/or fluorinated alcohol.

(B) Photoacid Generator

The PAG used herein may be any compound capable of generating an acid upon exposure to high-energy radiation including UV, DUV, EB, EUV, x-ray, excimer laser, -ray, and synchrotron radiation. Suitable PAGs include sulfonium salts, iodonium salts, sulfonyldiazomethane, N-sulfonyloxydicarboxylmide, O-arylsulfonyloxime, and O-alkylsulfonyloxime generators. The acid generators may be used alone or in admixture of two or more.

Sulfonium salts are salts of sulfonium cations with sulfonates, bis(substituted alkylsulfonyl)imides and tris(substituted alkylsulfonyl)methides. Suitable sulfonium cations include those cations having the general formula (8).

S⁺(R³R⁴R⁵)  (8)

Herein R³, R⁴ and R⁵ are each independently a substituted or unsubstituted, straight, branched or cyclic C₁-C₁₀ alkyl, alkenyl or oxoalkyl group or a substituted or unsubstituted C₆-C₁₈ aryl, aralkyl or aryloxoalkyl group, or any two of R³, R⁴ and R⁵ may bond together to form a ring with the sulfur atom in the formula.

Of the groups represented by R³ to R⁵, suitable alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, cyclopropyl, cyclopentyl, cyclohexyl, cyclopropylmethyl, 4-methylcyclohexyl, cyclohexylmethyl, norbornyl, and adamantyl. Suitable alkenyl groups include vinyl, allyl, propenyl, butenyl, hexenyl, and cyclohexenyl. Suitable oxoalkyl groups include 2-oxocyclopentyl, 2-oxocyclohexyl, 2-oxopropyl, 2-oxoethyl, 2-cyclopentyl-2-oxoethyl, 2-cyclohexyl-2-oxoethyl, and 2-(4-methylcyclohexyl)-2-oxoethyl. Suitable aryl groups include phenyl, naphthyl and thienyl, as well as hydroxyphenyl and alkoxyphenyl groups such as 4-hydroxyphenyl, 4-methoxyphenyl, 3-methoxyphenyl, 2-methoxyphenyl, 4-ethoxyphenyl, 4-tert-butoxyphenyl, and 3-tert-butoxyphenyl, alkylphenyl groups such as 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 4-ethylphenyl, 4-tert-butylphenyl, 4-n-butylphenyl, and 2,4-dimethylphenyl, alkylnaphthyl groups such as methylnaphthyl and ethylnaphthyl, alkoxynaphthyl groups such as methoxynaphthyl and ethoxynaphthyl, dialkylnaphthyl groups such as dimethylnaphthyl and diethylnaphthyl, and dialkoxynaphthyl groups such as dimethoxynaphthyl and diethoxynaphthyl. Suitable aralkyl groups include benzyl, 1-phenylethyl, and 2-phenylethyl. Suitable aryloxoalkyl groups are 2-aryl-2-oxoethyl groups including 2-phenyl-2-oxoethyl, 2-(1-naphthyl)-2-oxoethyl, and 2-(2-naphthyl)-2-oxoethyl. In these hydrocarbon groups, one or more hydrogen atoms may be substituted by fluorine or hydroxyl.

Alternatively, any two of R³, R⁴ and R⁵ bond together to form a ring with the sulfur atom in the formula. Exemplary ring structures are given below.

Herein R⁶ is as defined and illustrated for R³, R⁴ and R⁵.

As the anion of the sulfonium salt, exemplary sulfonates include trifluoromethanesulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, tridecafluorohexanesulfonate, 2,2,2-trifluoroethanesulfonate, pentafluorobenzenesulfonate, 1,1-difluoro-2-naphthylethanesulfonate, 1,1,2,2-tetrafluoro-2-(norbornan-2-yl)ethanesulfonate, 1,1,2,2-tetrafluoro-2-(tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-3-en-8-yl)ethanesulfonate, 2-benzoyloxy-1,1,3,3,3-pentafluoropropanesulfonate, 1,1-difluoro-2-tosyloxyethanesulfonate, adamantanemethoxycarbonyldifluoromethanesulfonate, 1-(3-hydroxymethyladamantane)methoxycarbonyldifluoromethane-sulfonate, methoxycarbonyldifluoromethanesulfonate, 1-(hexahydro-2-oxo-3,5-methano-2H-cyclopenta[b]furan-6-yl-oxycarbonyl)difluoromethanesulfonate, and 4-oxo-1-adamantyloxycarbonyldifluoromethanesulfonate. Exemplary bis(substituted alkylsulfonyl)imides include bis(trifluoromethylsulfonyl)imide, bis(pentafluoroethylsulfonyl)imide, bis(heptafluoropropylsulfonyl)imide, and perfluoro(1,3-propylenebissulfonyl)imide. A typical tris(substituted alkylsulfonyl)methide is tris(trifluoromethylsulfonyl)methide. Sulfonium salts based on combination of the foregoing examples are included.

Examples of the iodonium salt, N-sulfonyloxydicarboxylmide, O-arylsulfonyloxime, and O-alkylsulfonyloxime (or oximesulfonate) acid generators are described in JP-A 2009-269953.

Preferred examples of the PAG include triphenylsulfonium nonafluorobutanesulfonate, triphenylsulfonium bis(trifluoromethylsulfonyl)imide, triphenylsulfonium perfluoro(1,3-propylenebissulfonyl)imide, triphenylsulfonium tris(trifluoromethanesulfonyl)methide, N-nonafluorobutanesulfonyloxy-1,8-naphthalenedicarboxylmide, 2-(2,2,3,3,4,4-hexafluoro-1-(nonafluorobutylsulfonyloxy-imino)butyl)fluorene, and 2-(2,2,3,3,4,4,5,5-octafluoro-1-(nonafluorobutylsulfonyloxy-imino)pentyl)fluorene.

The preferred structure of PAG includes compounds having the general formula (P1).

Herein R⁸ is a C₁-C₃₀ alkyl, alkenyl or aralkyl group which may contain a heteroatom, R⁷ is hydrogen or trifluoromethyl, R³, R⁴ and R⁵ are as defined above.

In formula (P1), R⁸ is a C₁-C₃₀ alkyl, alkenyl or aralkyl group which may contain a heteroatom. Suitable heteroatoms contained in R⁸ include oxygen, nitrogen, sulfur and halogen atoms, with oxygen being preferred. The C₁-C₃₀ alkyl, alkenyl or aralkyl group of R⁸ may be straight, branched or cyclic while it is preferred for achieving a high resolution sufficient to form a fine size pattern that these groups have 6 to 30 carbon atoms. It is undesirable that R⁸ be aryl because the resulting resist pattern may have less smooth sidewalls. Exemplary groups of R⁸ include, but are not limited to, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, tert-butyl, pentyl, neopentyl, cyclopentyl, hexyl, cyclohexyl, 3-cyclohexenyl, heptyl, 2-ethylhexyl, nonyl, undecyl, tridecyl, pentadecyl, heptadecyl, 1-adamantyl, 2-adamantyl, 1-adamantylmethyl, norbornyl, norbornylmethyl, tricyclodecanyl, tetracyclododecanyl, tetracyclododecanylmethyl, dicyclohexylmethyl, eicosyl, allyl, benzyl, diphenylmethyl, tetrahydrofuryl, methoxymethyl, ethoxymethyl, methylthiomethyl, acetamidomethyl, trifluoromethyl, (2-methoxyethoxy)methyl, acetoxymethyl, 2-carboxy-1-cyclohexyl, 2-oxopropyl, 4-oxo-1-adamantyl, and 3-oxocyclohexyl.

With respect to the synthesis of the sulfonium salt having formula (P1), reference may be made to JP-A 2007-145797, 2008-106045, 2009-007327, and 2009-258695, for example.

Illustrative examples of the preferred PAG are given below.

Herein Ac stands for acetyl and Ph stands for phenyl.

An appropriate amount of the PAG having formula (P1) added is 0 to 40 parts by weight, and if added, 0.1 to 40 parts, and more preferably 0.1 to 20 parts by weight per 100 parts by weight of the base resin. Too high a proportion of the PAG may give rise to problems such as degraded resolution and foreign particles during development and resist film stripping. The PAG having formula (P1) may be used alone or in admixture of two or more or in admixture with another PAG. When the other PAG is added, its amount is arbitrary as long as the objects of the invention are not compromised. Typically the amount of the other PAG is 0 to 20 parts, preferably 0.1 to 10 parts by weight per 100 parts by weight of the base resin.

Notably, the resist composition comprises as base resin (A) a sulfonic acid anion-containing polymer having a triarylsulfonium cation, which also functions as PAG. Therefore, it is unnecessary to add PAG (B) although it is acceptable to use one or more PAGs (B) in combination with base resin (A).

It is noted that an acid diffusion controlling function may be provided when two or more PAGs are used in admixture provided that one PAG is an onium salt capable of generating a weak acid. Specifically, in a system using a mixture of an onium salt capable of generating a strong acid (e.g., fluorinated sulfonic acid) and an onium salt capable of generating a weak acid (e.g., non-fluorinated sulfonic acid or carboxylic acid), if the strong acid generated from the PAG upon exposure to high-energy radiation collides with the unreacted onium salt having a weak acid anion, then a salt exchange occurs whereby the weak acid is released and an onium salt having a strong acid anion is formed. In this course, the strong acid is exchanged into the weak acid having a low catalysis, incurring apparent deactivation of the acid for enabling to control acid diffusion.

If the PAG capable of generating a strong acid is an onium salt, an exchange from the strong acid generated upon exposure to high-energy radiation to a weak acid as above can take place, but it never happens that the weak acid generated upon exposure to high-energy radiation collides with the unreacted onium salt capable of generating a strong acid to induce a salt exchange. This is because of a likelihood of an onium cation forming an ion pair with a stronger acid anion.

(C) Quencher

The quencher (C) may be a compound capable of suppressing the rate of diffusion when the acid generated by the PAG diffuses within the resist film. The inclusion of quencher facilitates adjustment of resist sensitivity and holds down the rate of acid diffusion within the resist film, resulting in better resolution. In addition, it suppresses changes in sensitivity following exposure and reduces substrate and environment dependence, as well as improving the exposure latitude and the pattern profile. The inclusion of quencher is also effective for improving adhesion to the substrate.

Examples of suitable quenchers include primary, secondary, and tertiary aliphatic amines, mixed amines, aromatic amines, heterocyclic amines, nitrogen-containing compounds with carboxyl group, nitrogen-containing compounds with sulfonyl group, nitrogen-containing compounds with hydroxyl group, nitrogen-containing compounds with hydroxyphenyl group, alcoholic nitrogen-containing compounds, amide derivatives, imide derivatives, carbamate derivatives, and ammonium salts. Of these, preferred are tertiary amines, amine oxides, benzimidazoles, and anilines having a polar functional group such as ether, carbonyl, ester or alcohol.

Preferred tertiary amines include 2-morpholinoethyl esters of straight, branched or cyclic C₂-C₂₀ aliphatic carboxylic acids and trialkylamines having a straight, branched or cyclic C₂-C₁₀ alkyl moiety. Also included are substituted forms of these amines in which some carbon-bonded hydrogen atoms are replaced by hydroxyl groups. These amines may have an ether or ester linkage. Examples include 2-morpholinoethyl 2-methoxyacetate, 2-morpholinoethyl 2-(2-methoxyethoxy)acetate, 2-morpholinoethyl 2-[2-(2-methoxyethoxy)ethoxy]acetate, 2-morpholinoethyl hexanoate, 2-morpholinoethyl octanoate, 2-morpholinoethyl decanoate, 2-morpholinoethyl laurate, 2-morpholinoethyl myristate, 2-morpholinoethyl palmitate, 2-morpholinoethyl stearate, 2-morpholinoethyl cyclohexanecarboxylate, 2-morpholinoethyl adamantanecarboxylate, 4-[2-[(2-methoxyethoxy)methoxy]ethyl]morpholine, 4-[2-[2-(2-methoxyethoxy)ethoxy]ethyl]morpholine, 4-[2-[2-(2-butoxyethoxy)ethoxy]ethyl]morpholine, tris(2-methoxymethoxyethyl)amine, tris{2-(2-methoxyethoxy)ethyl}amine, tris{2-(2-methoxyethoxymethoxy)ethyl}amine, tris{2-(1-methoxyethoxy)ethyl}amine, tris{2-(1-ethoxyethoxy)ethyl}amine, tris(2-acetoxyethyl)amine, tris(2-propionyloxyethyl)amine, tris(2-butyryloxyethyl)amine, tris(2-isobutyryloxyethyl)amine, tris(2-valeryloxyethyl)amine, and tris(2-pivaloyloxyethyl)amine.

Preferred examples of the benzimidazoles include benzimidazole, 2-phenylbenzimidazole, 1-(2-acetoxyethoxy)benzimidazole, 1-[2-(methoxymethoxy)ethyl]benzimidazole, 1-[2-(methoxymethoxy)ethyl]-2-phenylbenzimidazole, and 1-(2-(2-(2-methoxyethoxy)ethoxy)ethyl)benzimidazole.

Preferred examples of the anilines include aniline, N-methylaniline, N-ethylaniline, N-propylaniline, N,N-dimethylaniline, N,N-bis(hydroxyethyl)aniline, 2-methylaniline, 3-methylaniline, 4-methylaniline, ethylaniline, propylaniline, dimethylaniline, 2,6-diisopropylaniline, trimethylaniline, 2-nitroaniline, 3-nitroaniline, 4-nitroaniline, 2,4-dinitroaniline, 2,6-dinitroaniline, 3,5-dinitroaniline, and N,N-dimethyltoluidine.

Also included are primary and secondary amines which have been protected with tert-butoxycarbonyl (tBOC). Those compounds described in JP-A 2007-298569 and JP-A 2010-020204 are also useful.

The quenchers may be used alone or in admixture of two or more. The quencher is preferably used in an amount of 0.001 to 8 parts, more preferably 0.01 to 4 parts by weight per 100 parts by weight of the base resin. Less than 0.001 part of the quencher may achieve no addition effect whereas more than 8 parts may lead to too low a sensitivity.

(D) Organic Solvent

The organic solvent (D) used herein may be any organic solvent in which the polymer (or base resin), acid generator, quencher, and other components are soluble. Illustrative, non-limiting, examples of the organic solvent include ketones such as cyclohexanone and methyl amyl ketone; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, and 1-ethoxy-2-propanol; ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol dimethyl ether, and diethylene glycol dimethyl ether; esters such as propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, and propylene glycol mono-tert-butyl ether acetate; and lactones such as butyrolactone, which may be used alone or in combinations of two or more. Of the above organic solvents, it is recommended to use 1-ethoxy-2-propanol, PGMEA, cyclohexanone, butyrolactone, and mixtures thereof because the acid generator is most soluble therein.

An appropriate amount of the organic solvent used is 200 to 5,000 parts, more preferably 400 to 3,000 parts by weight per 100 parts by weight of the base resin.

(E) Surfactant

Component (E) is a surfactant which is insoluble or substantially insoluble in water and soluble in alkaline developer, and/or a surfactant which is insoluble or substantially insoluble in water and alkaline developer (hydrophobic resin). The surfactant (E) may be added to the resist composition. Reference should be made to those compounds defined as component (S) in JP-A 2010-215608 and JP-A 2011-016746.

While many examples of the surfactant which is insoluble or substantially insoluble in water and alkaline developer are described in these patent documents, preferred examples are FC-4430, Surflon S-381, Surfynol E1004, KH-20 and KH-30, which may be used alone or in admixture. Partially fluorinated oxetane ring-opened polymers having the structural formula (surf-1) are also useful.

It is provided herein that R, Rf, A, B, C, m, and n are applied to only formula (surf-1), independent of their descriptions other than for the surfactant. R is a di- to tetra-valent C₂-C₅ aliphatic group. Exemplary divalent groups include ethylene, 1,4-butylene, 1,2-propylene, 2,2-dimethyl-1,3-propylene and 1,5-pentylene. Exemplary tri- and tetra-valent groups are shown below.

Herein the broken line denotes a valence bond. These formulae are partial structures derived from glycerol, trimethylol ethane, trimethylol propane, and pentaerythritol, respectively. Of these, 1,4-butylene and 2,2-dimethyl-1,3-propylene are preferably used.

Rf is trifluoromethyl or pentafluoroethyl, and preferably trifluoromethyl. The letter m is an integer of 0 to 3, n is an integer of 1 to 4, and the sum of m and n, which represents the valence of R, is an integer of 2 to 4. A is equal to 1, B is an integer of 2 to 25, and C is an integer of 0 to 10. Preferably, B is an integer of 4 to 20, and C is 0 or 1. Note that the above structural formula does not prescribe the arrangement of respective constituent units while they may be arranged either in blocks or randomly. For the preparation of surfactants in the form of partially fluorinated oxetane ring-opened polymers, reference should be made to U.S. Pat. No. 5,650,483, for example.

The surfactant which is insoluble or substantially insoluble in water and soluble in alkaline developer is useful when ArF immersion lithography is applied to the resist composition in the absence of a resist protective film. In this embodiment, the surfactant has a propensity to segregate on the resist surface after spin coating for achieving a function of minimizing water penetration or leaching. The surfactant is also effective for preventing water-soluble components from being leached out of the resist film for minimizing any damage to the exposure tool. The surfactant becomes solubilized during alkaline development following exposure and PEB, and thus forms few or no foreign particles which become defects. The preferred surfactant is a polymeric surfactant which is insoluble or substantially insoluble in water, but soluble in alkaline developer, also referred to as “hydrophobic resin” in this sense, and especially which is water repellent and enhances water slippage. Suitable polymeric surfactants are shown below.

Herein R¹¹⁴ is each independently hydrogen, fluorine, methyl or trifluoromethyl. R¹¹⁵ is each independently hydrogen or a straight, branched or cyclic C₁-C₂₀ alkyl or fluoroalkyl group, or two R¹¹⁵ in a common monomer may bond together to form a ring with the carbon atom to which they are attached, and in this event, they together represent a straight, branched or cyclic C₂-C₂₀ alkylene or fluoroalkylene group. R¹¹⁶ is fluorine or hydrogen, or R¹¹⁶ may bond with R¹¹⁷ to form a non-aromatic ring of 3 to 10 carbon atoms in total with the carbon atom to which they are attached. R¹¹⁷ is a straight, branched or cyclic C₁-C₆ alkylene group in which at least one hydrogen atom may be substituted by a fluorine atom. R¹¹⁸ is a straight or branched C₁-C₁₀ alkyl group in which at least one hydrogen atom is substituted by a fluorine atom. Alternatively, R¹¹⁷ and R¹¹⁸ may bond together to form a non-aromatic ring with the carbon atoms to which they are attached. In this event, R¹¹⁷, R¹¹⁸ and the carbon atoms to which they are attached together represent a trivalent organic group of 2 to 12 carbon atoms in total. R¹¹⁹ is a single bond or a C₁-C₄ alkylene. R¹²° is each independently a single bond, —O—, or —CR¹¹⁴R¹¹⁴—. R¹²¹ is a straight or branched C₁-C₄ alkylene group, or may bond with R¹¹⁵ within a common monomer to form a C₃-C₆ non-aromatic ring with the carbon atom to which they are attached. R¹²² is 1,2-ethylene, 1,3-propylene, or 1,4-butylene. Rf is a linear perfluoroalkyl group of 3 to 6 carbon atoms, typically 3H-perfluoropropyl, 4H-perfluorobutyl, 5H-perfluoropentyl, or 6H-perfluorohexyl. X′ is each independently —C(═O)—O—, —O—, or —C(═O)—R¹²³—C(═O)—O—. R¹²³ is a straight, branched or cyclic C₁-C₁₀ alkylene group. The subscripts are in the range: 0 (a′−1)<1, 0 (a′−2)<1, 0 (a′−3)<1, 0<(a′−1)+(a′−2)+(a′−3)<1, 0 b′<1, 0 c′<1, and 0<(a′−1)+(a′−2)+(a′−3)+b′+c′ 1.

Examples of these units are shown below.

For the surfactant which is insoluble or substantially insoluble in water and soluble in alkaline developer, reference may be made to JP-A 2008-122932, 2010-134012, 2010-107695, 2009-276363, 2009-192784, 2009-191151, 2009-98638, 2010-250105, and 2011-42789.

The polymeric surfactant preferably has a Mw of 1,000 to 50,000, more preferably 2,000 to 20,000 as measured by GPC versus polystyrene standards. A surfactant with a Mw outside the range may be less effective for surface modification and cause development defects. The polymeric surfactant is preferably formulated in an amount of 0.001 to 20 parts, and more preferably 0.01 to 10 parts by weight per 100 parts by weight of the base resin. Reference should also be made to JP-A 2010-215608.

To the resist composition, a compound which is decomposed with an acid to generate another acid, that is, acid amplifier compound may be added. For these compounds, reference should be made to JP-A 2009-269953 and 2010-215608. In the resist composition, an appropriate amount of the acid amplifier compound is up to 2 parts, and especially up to 1 part by weight per 100 parts by weight of the base resin. Excessive amounts of the acid amplifier compound make diffusion control difficult, leading to degradation of resolution and pattern profile.

Optionally, an organic acid derivative or a compound having a Mw of up to 3,000 which changes its solubility in alkaline developer under the action of an acid, also referred to as dissolution inhibitor, may be added. Reference may be made to JP-A 2009-269953 and 2010-215608.

Process

A further embodiment of the invention is a pattern forming process using the resist composition defined above. A pattern may be formed from the resist composition using any well-known lithography process. The preferred process includes at least the steps of forming a resist film on a substrate, exposing it to high-energy radiation, and developing it in a developer.

The resist composition is applied onto a substrate for integrated circuit fabrication (e.g., Si, SiO₂, SiN, SiON, TiN, WSi, BPSG, SOG or organic antireflective coating) by a suitable coating technique such as spin coating. The coating is prebaked on a hot plate at a temperature of 60 to 150° C. for 1 to 10 minutes, preferably 80 to 140° C. for 1 to 5 minutes, to form a resist film of 0.05 to 2.0 m thick. The resist film is then exposed by the ArF immersion lithography. A mask having the desired pattern is placed over the resist film, a liquid, typically water, is interposed between the mask and the resist film, and the resist film is exposed to ArF excimer laser radiation in a dose of 1 to 200 mJ/cm², and preferably 10 to 100 mJ/cm². Prior to exposure, a protective film which is insoluble in water may be formed on the resist film, if desired.

After exposure, the resist film is baked (PEB) on a hot plate at 60 to 150° C. for 1 to 5 minutes, and preferably at 80 to 140° C. for 1 to 3 minutes. This is followed by development in a developer which is an alkaline aqueous solution, typically an aqueous solution of 0.1 to 5 wt %, more typically 2 to 3 wt % of tetramethylammonium hydroxide (TMAH). Development may be carried out by a conventional method such as dip, puddle, or spray development for 0.1 to 3 minutes, and preferably 0.5 to 2 minutes. These steps result in the formation of the desired pattern on the substrate.

The water-insoluble protective film which is used in the immersion lithography is to prevent any components from being leached out of the resist film and to improve water slippage at the film surface and is generally divided into two types. The first type is an organic solvent-strippable protective film which must be stripped, prior to alkaline development, with an organic solvent in which the resist film is not dissolvable. The second type is an alkali-soluble protective film which is soluble in an alkaline developer so that it can be removed simultaneously with the removal of solubilized regions of the resist film. The protective film of the second type is preferably of a material comprising a polymer having a 1,1,1,3,3,3-hexafluoro-2-propanol residue (which is insoluble in water and soluble in an alkaline developer) as a base in an alcohol solvent of at least 4 carbon atoms, an ether solvent of 8 to 12 carbon atoms or a mixture thereof. Alternatively, the aforementioned surfactant which is insoluble in water and soluble in an alkaline developer may be dissolved in an alcohol solvent of at least 4 carbon atoms, an ether solvent of 8 to 12 carbon atoms or a mixture thereof to form a material from which the protective film of the second type is formed.

Any desired step may be added to the pattern forming process. For example, after a photoresist film is formed, a step of rinsing with pure water (post-soaking) may be introduced to extract the acid generator or the like from the film surface or wash away particles. After exposure, a step of rinsing (post-soaking) may be introduced to remove any water remaining on the film after exposure.

The technique enabling the ArF lithography to survive to the 32-nm node is a double patterning process. The double patterning process includes a trench process of processing an underlay to a 1:3 trench pattern by a first step of exposure and etching, shifting the position, and forming a 1:3 trench pattern by a second step of exposure for forming a 1:1 pattern; and a line process of processing a first underlay to a 1:3 isolated left pattern by a first step of exposure and etching, shifting the position, processing a second underlay formed below the first underlay by a second step of exposure through the 1:3 isolated left pattern, for forming a half-pitch 1:1 pattern.

In the pattern forming process, an alkaline aqueous solution, typically an aqueous solution of 0.1 to 5 wt %, more typically 2 to 3 wt % of tetramethylammonium hydroxide (TMAH) is often used as the developer. The negative tone development technique wherein the unexposed region is developed and dissolved in an organic solvent is also applicable.

In the organic solvent development, the organic solvent used as the developer is preferably selected from 2-octanone, 2-nonanone, 2-heptanone, 3-heptanone, 4-heptanone, 2-hexanone, 3-hexanone, diisobutyl ketone, methylcyclohexanone, acetophenone, methylacetophenone, propyl acetate, butyl acetate, isobutyl acetate, amyl acetate, isoamyl acetate, butenyl acetate, phenyl acetate, propyl formate, butyl formate, isobutyl formate, amyl formate, isoamyl formate, methyl valerate, methyl pentenoate, methyl crotonate, ethyl crotonate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, isobutyl lactate, amyl lactate, isoamyl lactate, methyl 2-hydroxyisobutyrate, ethyl 2-hydroxyisobutyrate, methyl benzoate, ethyl benzoate, benzyl acetate, methyl phenylacetate, benzyl formate, phenylethyl formate, methyl 3-phenylpropionate, benzyl propionate, ethyl phenylacetate, and 2-phenylethyl acetate. These organic solvents may be used alone or in admixture of two or more.

EXAMPLE

Examples of the invention are given below by way of illustration and not by way of limitation. Mw and Mn are weight and number average molecular weights, respectively, and Mw/Mn is a polydispersity index.

Synthesis Example 1-1 Synthesis of triethylammonium 1,1,3,3,3-pentafluoro-2-hydroxypropane-1-sulfonate

In accordance with the method of JP-A 2007-304490, triethylammonium 1,1,3,3,3-pentafluoro-2-(pivaloyloxy)-propane-1-sulfonate was synthesized. In accordance with the method of JP-A 2007-145804, the pivaloyl group was subjected to hydrolysis (or solvolysis), obtaining triethylammonium 1,1,3,3,3-pentafluoro-2-hydroxypropane-1-sulfonate as white crystals.

Synthesis Example 1-2 Synthesis of triethylammonium 1,1,3,3,3-pentafluoro-2-methacryloyloxypropane-1-sulfonate

In 400 g of methylene chloride were dissolved 79 g (0.16 mol) of triethylammonium 1,1,3,3,3-pentafluoro-2-hydroxypropane-1-sulfonate obtained in Synthesis Example 1-1, 19 g (0.19 mol) of triethylamine, and 0.10 g (0.8 mmol) of N,N′-dimethylaminopyridine. Under ice cooling, 28 g (0.18 mol) of methacrylic anhydride was added dropwise to the solution, followed by stirring overnight at room temperature. Then dilute hydrochloric acid was added to quench the reaction. The organic layer was separated and washed with water. After water washing, the organic layer was concentrated, combined with methyl isobutyl ketone, and concentrated again. The residue was washed with diisopropyl ether, obtaining 45 g of the target, triethylammonium 1,1,3,3,3-pentafluoro-2-methacryloyloxypropane-1-sulfonate as oily matter. Yield 70%.

Synthesis Example 2-1 Synthesis of Polymer P-1

In a flask purged with nitrogen, 9 g of triethylammonium 1,1,3,3,3-pentafluoro-2-methacryloyloxy-propane-1-sulfonate obtained in Synthesis Example 1-2, 47 g of 1-isopropylcyclopentyl methacrylate, 7 g of 2-oxotetrahydrofuran-3-yl methacrylate, 37 g of 9-methoxycarbonyl-4-oxatricyclo[4.2.1.0^(3,7)]nonan-5-on-2-yl methacrylate, 5 g of dimethyl 2,2′-azobis(2-methylpropionate), and 0.7 g of 2-mercaptoethanol were dissolved in 192 g of methyl ethyl ketone to form a monomer solution. Another flask purged with nitrogen was charged with 58 g of methyl ethyl ketone, which was stirred and heated at 80° C. Thereafter, the monomer solution was added dropwise over 4 hours. After the completion of dropwise addition, the polymerization solution was stirred for a further 2 hours while maintaining at 80° C. After the polymerization solution was cooled to room temperature, it was added dropwise to 1,000 g of hexane. A precipitating copolymer was filtered. The copolymer was washed 2 times with a mixture of 120 g of methyl ethyl ketone and 480 g of hexane, and vacuum dried at 50° C. for 20 hours, obtaining 88 g of the copolymer in white powder form. The copolymer was analyzed by ¹H-NMR spectroscopy, finding a copolymer compositional ratio of 5/55/10/30 mol % in the described order of monomers.

FIG. 1 is the diagram of nuclear magnetic resonance spectroscopy (¹H-NMR/DMSO-d₆) of the target. In ¹H-NMR analysis, a trace amount of solvent (diisopropyl ether) was observed.

Synthesis Examples 2-2 to 2-10 Synthesis of Polymers P-2 to P-10

A series of resins as shown in Table 1 were prepared by the same procedure as in Synthesis Example 2-1 except that the type and ratio of monomers were changed. The units in Table 1 have the structure shown in Tables 2 to 4. In Table 1, the ratio of units is a molar ratio.

Synthesis Example 2-11 Synthesis of Polymer P-11

Polymer P-1 obtained in Synthesis Example 2-1, 10 g, was dissolved in 100 g of methylene chloride, followed by five cycles of water washing and separating operation using 30 g of water. The reaction solution was concentrated, combined with methyl isobutyl ketone, and concentrated again. Diisopropyl ether was added to the concentrate for recrystallization. The solid was collected, washed with diisopropyl ether, and vacuum dried at 50° C., completing purification of Polymer P-1. The thus purified Polymer P-1 was mixed with 90 g of methylene chloride, 45 g of water and an amount (corresponding to 4 mmol) of triphenylsulfonium chloride, and stirred for 30 minutes at room temperature. The organic layer was separated, washed 5 times with water, concentrated, combined with methyl isobutyl ketone, and concentrated again. Diisopropyl ether was added to the concentrate for recrystallization. The solid was collected, washed with diisopropyl ether, and vacuum dried at 50° C., obtaining 8.5 g of the target, Polymer P-11. On ¹H-NMR analysis, it had a copolymer compositional ratio of 5/55/10/30 mol % in the described order of monomers.

FIG. 2 is the diagram of spectroscopy (¹H-NMR/DMSO-d₆) of the copolymer. In ¹H-NMR analysis, a trace amount of solvent (diisopropyl ether) was observed. A comparison of FIG. 2 with FIG. 1 reveals that in FIG. 2, the peak (9H, 1.2 ppm) assigned to methyl and the peak (6H, 3.1 ppm) assigned to methylene on the triethylammonium cation were extinguished, and instead, peaks indicative of triphenylsulfonium salt (e.g., peaks at 7.7 ppm to 7.9 ppm assigned to aromatic) were detected. These results demonstrate that the cation moiety of the polymer was converted from triethylammonium to triarylsulfonium. The residual monomer was detected by HPLC, finding a content of 0.3%.

Synthesis Examples 2-12 to 2-22 Synthesis of Polymers P-12 to P-22

A series of resins as shown in Table 1 were prepared by the same procedure as in Synthesis Example 2-11 except that the type and ratio of monomers were changed.

Synthesis Example 2-23 Synthesis of Polymer P-23

The procedure used herein was similar to Synthesis Example 2-1. In a flask purged with nitrogen, 14 g of triphenylsulfonium 1,1,3,3,3-pentafluoro-2-methacryloyloxy-propane-1-sulfonate, 47 g of 1-isopropylcyclopentyl methacrylate, 7 g of 2-oxotetrahydrofuran-3-yl methacrylate, 37 g of 9-methoxycarbonyl-4-oxatricyclo[4.2.1.0^(3,7)]nonan-5-on-2-yl methacrylate, 5 g of dimethyl 2,2′-azobis(2-methylpropionate), and 0.7 g of 2-mercaptoethanol were dissolved in 191 g of methyl ethyl ketone to form a monomer solution. Another flask purged with nitrogen was charged with 58 g of methyl ethyl ketone, which was stirred and heated at 80° C. Thereafter, the monomer solution was added dropwise over 4 hours. After the completion of dropwise addition, the polymerization solution was stirred for a further 2 hours while maintaining at 80° C. After the polymerization solution was cooled to room temperature, it was added dropwise to 1,000 g of hexane. A precipitating copolymer was filtered. The copolymer was washed 2 times with a mixture of 120 g of methyl ethyl ketone and 480 g of hexane, and vacuum dried at 50° C. for 20 hours, obtaining 90 g of the copolymer in white powder form. The copolymer was analyzed by ¹H-NMR spectroscopy, finding a copolymer compositional ratio of 5/55/10/30 mol % in the described order of monomers.

Polymer P-23 had the same composition as Polymer P-11, but its residual monomer content was 2.1% as measured by HPLC, and more than in Polymer P-11.

Synthesis Examples 2-24 to 2-30 Synthesis of Polymers P-24 to P-30

A series of resins as shown in Table 1 were prepared by the same procedure as in Synthesis Example 2-23 except that the type and ratio of monomers were changed.

TABLE 1 Unit 1 Unit 2 Unit 3 Unit 4 Unit 5 Resin (ratio) (ratio) (ratio) (ratio) (ratio) P-1 A-1 (0.05) B-1 (0.55) C-1 (0.10) C-4 (0.30) — P-2 A-1 (0.08) B-1 (0.55) C-1 (0.07) C-4 (0.30) — P-3 A-1 (0.04) B-1 (0.55) C-1 (0.11) C-4 (0.30) — P-4 A-1 (0.10) B-3 (0.30) C-3 (0.30) C-7 (0.30) — P-5 A-1 (0.10) B-3 (0.30) C-2 (0.40) C-7 (0.20) — P-6 A-1 (0.10) B-3 (0.30) C-3 (0.30) C-6 (0.30) — P-7 A-1 (0.10) B-3 (0.30) C-2 (0.30) C-6 (0.30) — P-8 A-1 (0.10) B-2 (0.10) B-4 (0.20) C-3 (0.30) C-7 (0.30) P-9 A-1 (0.10) B-5 (0.30) C-4 (0.30) C-7 (0.30) — P-10 A-1 (0.10) B-3 (0.25) C-2 (0.15) C-5 (0.25) C-7 (0.25) P-11 A-2 (0.05) B-1 (0.55) C-1 (0.10) C-4 (0.30) — P-12 A-2 (0.08) B-1 (0.55) C-1 (0.07) C-4 (0.30) — P-13 A-2 (0.04) B-1 (0.55) C-1 (0.11) C-4 (0.30) — P-14 A-3 (0.08) B-1 (0.50) C-1 (0.22) C-4 (0.20) — P-15 A-4 (0.08) B-1 (0.50) C-1 (0.22) C-4 (0.20) — P-16 A-2 (0.10) B-3 (0.30) C-3 (0.30) C-7 (0.30) — P-17 A-2 (0.10) B-3 (0.30) C-2 (0.40) C-7 (0.20) — P-18 A-2 (0.10) B-3 (0.30) C-3 (0.30) C-6 (0.30) — P-19 A-2 (0.10) B-3 (0.30) C-2 (0.30) C-6 (0.30) — P-20 A-2 (0.10) B-2 (0.10) B-4 (0.20) C-3 (0.30) C-7 (0.30) P-21 A-2 (0.10) B-5 (0.30) C-4 (0.30) C-7 (0.30) — P-22 A-2 (0.10) B-3 (0.25) C-2 (0.15) C-5 (0.25) C-7 (0.25) P-23 A-2 (0.05) B-1 (0.55) C-1 (0.10) C-4 (0.30) — P-24 A-2 (0.08) B-1 (0.55) C-1 (0.07) C-4 (0.30) — P-25 A-5 (0.08) B-1 (0.55) C-1 (0.07) C-4 (0.30) — P-26 A-2 (0.10) B-3 (0.30) C-3 (0.30) C-6 (0.30) — P-27 A-2 (0.10) B-5 (0.30) C-4 (0.30) C-7 (0.30) — P-28 B-1 (0.50) C-1 (0.20) C-4 (0.30) — — P-29 B-3 (0.40) C-3 (0.30) C-7 (0.30) — — P-30 B-5 (0.40) C-4 (0.30) C-7 (0.30) — —

TABLE 2

A-1

A-2

A-3

A-4

A-5

TABLE 3

B-1

B-2

B-3

B-4

B-5

TABLE 4

C-1

C-2

C-3

C-4

C-5

C-6

C-7

Preparation of Resist Composition Examples 1-1 to 1-12 & Comparative Examples 1-1 to 1-8

Resist compositions in solution form were prepared by mixing and dissolving a polymer (obtained in Synthesis Examples), photoacid generator, amine quencher, and alkali-soluble surfactant (F-1) in a solvent according to the formulation shown in Table 5 and filtering through a Teflon° filter having a pore size of 0.2 m. In all runs, the solvent contained 0.01 wt % of surfactant (F-2).

TABLE 5 Resin PAG Quencher Surfactant Solvent 1 Solvent 2 Resist (pbw) (pbw) (pbw) (pbw) (pbw) (pbw) Example 1-1 R-1 P-11(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-2 R-2 P-12(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-3 R-3 P-13(80) PAG-1(3.8) Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-4 R-4 P-14(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-5 R-5 P-15(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-6 R-6 P-16(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) 1-7 R-7 P-17(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) 1-8 R-8 P-18(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) 1-9 R-9 P-19(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576)  1-10 R-10 P-20(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576)  1-11 R-11 P-21(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576)  1-12 R-12 P-22(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) Comparative 1-1 R-13 P-23(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) Example 1-2 R-14 P-24(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-3 R-15 P-25(80) — Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-4 R-16 P-26(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) 1-5 R-17 P-27(80) — Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) 1-6 R-18 P-28(80) PAG-1(7.6) Q-1(1.6) F-1(5.0) PGMEA(1,728) GBL(192) 1-7 R-19 P-29(80) PAG-1(7.6) Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576) 1-8 R-20 P-30(80) PAG-2(6.6) Q-1(1.6) F-1(5.0) PGMEA(1,344) CyHO(576)

The PAG, solvent, amine quencher, alkali-soluble surfactant (F-1) and surfactant (F-2) used herein are identified below.

Photoacid Generator

-   -   PAG-1: triphenylsulfonium nonafluoro-1-butanesulfonate     -   PAG-2: triphenylsulfonium         2-(adamantane-1-carbonyloxy)-1,1,3,3,3-pentafluoropropane-1-sulfonate         (see JP-A 2007-145797)

Organic Solvent

-   -   PGMEA: propylene glycol monomethyl ether acetate     -   GBL: butyrolactone     -   CyHO: cyclohexanone

Quencher

-   -   Q-1: 2,6-diisopropylaniline

Surfactant

-   -   F-1:         poly(3,3,3-trifluoro-2-hydroxy-1,1-dimethyl-2-trifluoromethylpropyl         methacrylate/1,1,1-trifluoro-2-hydroxy-6-methyl-2-trifluoromethylhept-4-yl         methacrylate) (described in JP-A 2008-122932) Mw 7,300,         Mw/Mn=1.86

-   -   F-2:         3-methyl-3-(2,2,2-trifluoroethoxymethyl)oxetane/tetrahydrofuran/2,2-dimethyl-1,3-propane         diol copolymer (Omnova Solutions, Inc.)

-   -   -   a:(b+b'):(c+c')=1:4-7:0.01-1 (molar ratio)         -   Mw=1,500

Evaluation of Resist Examples 2-1 to 2-12 and Comparative Examples 2-1 to 2-8

An antireflective coating solution (ARC-29A by Nissan Chemical Industries Co., Ltd.) was coated onto a silicon substrate and baked at 200° C. for 60 seconds to form an ARC film of 100 nm thick. The resist solution was spin coated onto the ARC film and baked on a hot plate at 100° C. for 60 seconds to form a resist film of 90 nm thick. The resist film was exposed according to the ArF immersion lithography on an ArF excimer laser scanner NSR-S610C (Nikon Corp., NA 1.30, dipole illumination, 6% halftone phase shift mask). The resist film was baked (PEB) at an arbitrary temperature for 60 seconds and developed in a 2.38 wt % aqueous solution of tetramethylammonium hydroxide for 60 seconds.

The resist was evaluated by observing a 40-nm 1:1 line-and-space pattern under an electron microscope. The optimum dose (Eop) was a dose (mJ/cm²) which provided a line width of 40 nm. The profile of a L/S pattern at the optimum dose was compared and evaluated according to the following criterion.

-   -   Passed: Pattern of rectangular profile with perpendicular         sidewall     -   Rejected: Pattern of tapered profile with sharply graded         sidewall, or top-rounded profile due to top loss

The width of lines of a 40-nm 1:1 line-and-space pattern was measured under SEM to determine a line width variation, which was reported as line width roughness (LWR). A smaller value of LWR indicates a better line pattern with a less fluctuation.

Defects in the pattern as developed were inspected by a flaw detector KLA2800 (KLA-Tencor). A defect density (count/cm²) was computed by dividing the total number of detected defects by a detection area. The pattern formed was an iterated 40-nm 1:1 line-and-space pattern. The defect inspection conditions included light source UV, inspected pixel size 0.28 m, and cell-to-cell mode. In this test, the sample was rated good for a defect density of less than 0.05 defect/cm² and poor for a density of equal to or more than 0.05 defect/cm².

The test results of inventive and comparative resist compositions in Table 5 are shown in Table 6.

TABLE 6 Eop (mJ/ LWR Defect density Resist cm²) Profile (nm) (count/cm²) Example 2-1 R-1 31 Passed 4.4 0.02 2-2 R-2 30 Passed 4.6 0.03 2-3 R-3 33 Passed 4.7 0.02 2-4 R-4 34 Passed 4.5 0.04 2-5 R-5 36 Passed 4.8 0.03 2-6 R-6 32 Passed 4.6 0.02 2-7 R-7 30 Passed 4.5 0.03 2-8 R-8 31 Passed 4.4 0.03 2-9 R-9 31 Passed 4.5 0.03  2-10 R-10 30 Passed 4.7 0.04  2-11 R-11 32 Passed 4.8 0.04  2-12 R-12 32 Passed 4.5 0.03 Comparative 2-1 R-13 32 Rejected 5.1 0.11 Example 2-2 R-14 31 Rejected 5.0 0.14 2-3 R-15 31 Rejected 5.6 0.20 2-4 R-16 35 Rejected 5.4 0.09 2-5 R-17 36 Rejected 5.5 0.16 2-6 R-18 35 Rejected 5.6 0.08 2-7 R-19 38 Rejected 5.7 0.07 2-8 R-20 40 Rejected 5.8 0.10

As seen from the data in Table 6, the resist compositions comprising polymers prepared by the method of the invention display good pattern profile and low LWR, as compared with the resist compositions comprising Polymers P-23 to 27 prepared by the prior art method or sulfonium salt-free Polymers P-28 to 30. Also a lower defect density was demonstrated.

While the invention has been illustrated and described in typical embodiments, it is not intended to be limited to the details shown. Any modified embodiments having substantially the same features and achieving substantially the same results as the technical idea disclosed herein are within the spirit and scope of the invention.

Japanese Patent Application No. 2012-039638 is incorporated herein by reference.

Although some preferred embodiments have been described, many modifications and variations may be made thereto in light of the above teachings. It is therefore to be understood that the invention may be practiced otherwise than as specifically described without departing from the scope of the appended claims. 

1. A method of preparing a sulfonic acid anion-containing polymer having a triarylsulfonium cation, comprising the steps of: (1) preparing a sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto, (2) subjecting the polymer to water washing or crystallization, and (3) then reacting the polymer with a triarylsulfonium salt.
 2. The method of claim 1 wherein the anion moiety of sulfonic acid anion-containing unit in the sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto is of the structure having the general formula (1):

wherein R¹ is hydrogen, fluorine, methyl or trifluoromethyl, and L is a divalent C₁-C₂₀ organic group which may contain a heteroatom.
 3. The method of claim 1 wherein in step (3), a triarylsulfonium salt having the general formula (7) acts on a polymer having the general formula (5) to induce cation exchange reaction,

wherein R¹ is hydrogen, fluorine, methyl or trifluoromethyl, L is a divalent C₁-C₂₀ organic group which may contain a heteroatom, and M⁺ is an ammonium or metal cation, S⁺(Ar)₃X⁻  (7) wherein Ar is a substituted or unsubstituted C₆-C₂₀ aryl group which may contain a heteroatom, a plurality of Ar groups may bond together directly or via an oxygen atom, methylene, sulfonyl or carbonyl moiety, and X⁻is an anion.
 4. The method of claim 1, wherein the sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto further comprises recurring units having the general formula (2):

wherein R^(1′) is hydrogen, fluorine, methyl or trifluoromethyl, Z is a single bond, phenylene, naphthylene or (backbone) —C(═O)—O—Z′—, Z′ is a straight, branched or cyclic C₁-C₁₀ alkylene group which may contain a hydroxyl radical, ether bond, ester bond, or lactone ring, or a phenylene or naphthylene group, and XA is an acid labile group.
 5. The method of claim 4, wherein the sulfonic acid anion-containing polymer having an ammonium or metal cation not bound thereto further comprises recurring units having the general formula (3):

wherein R^(1″) is hydrogen, fluorine, methyl or trifluoromethyl, and YL is a polar group having one or more structures selected from the group consisting of hydroxyl, cyano, carbonyl, ether bond, ester bond, sulfonic acid ester bond, carbonate, lactone ring, sultone ring, and carboxylic anhydride.
 6. The method of claim 1 wherein the step (3) of reacting the polymer from step (2) with a triarylsulfonium salt is performed in a two-layer system using water and an organic solvent separable from water.
 7. A polymer prepared by the method of claim
 1. 8. A resist composition comprising a polymer prepared by the method of claim
 1. 9. The resist composition of claim 8, further comprising a photoacid generator.
 10. The resist composition of claim 8, further comprising a quencher.
 11. The resist composition of claim 8, further comprising a solvent.
 12. The resist composition of claim 8, further comprising a surfactant.
 13. A pattern forming process comprising the steps of coating the resist composition of claim 8 onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, and developing it in a developer.
 14. The pattern forming process of claim 13 wherein the high-energy radiation has a wavelength in the range of 180 to 250 nm.
 15. The pattern forming process of claim 13 wherein the step of exposing to high-energy radiation includes immersion lithography of exposing the resist film to radiation via a liquid.
 16. The pattern forming process of claim 15, further comprising the step of forming a protective film on the resist film, so that the protective film intervenes between the resist film and the liquid during the immersion lithography.
 17. The pattern forming process of claim 13 wherein the high-energy radiation is EUV or EB. 